2nd World Congress on Industrial Process Tomography
Digital MicroLaminography for High-Resolution Inspection of Electronic Assemblies
Alexander Sasov, SkyScan
SkyScan, Vluchtenburgstraat 3, Aartselaar B-2630, Belgium, skyscan@skynet.be
ABSTRACT
X-ray microlaminography allows getting local depth information from the big flat objects like PCBs and electronic assemblies, which cannot be reconstructed by tomographical approach. According to the needs in high-resolution inspection for electronic and micromechanical industries an X-ray microlaminography system has been developed. This instrument based on a new approach for the x- ray geometry with a minimum of moving parts and a digital extraction of depth information (tomosynthesis) about all layers during one fast scan. The main application areas are BGA inspection, Flip-Chips, multilayer PCBs, micromechanics (watch, etc.).
Keywords X-ray inspection, laminography, tomosynthesis, nondestructive evaluation
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